Silicon Wafer, Type P, 1"
These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer.
Specifications
|
1" |
Material: |
Silicon |
Diameter: |
25 mm |
Orientation: |
<100> |
Resistance: |
1-30 Ohms |
Type P: |
Boron - 1 primary flat |
SiO2 top coating: |
None |
Wafer Thickness: |
10-12 mill (254-304µm) |
Roughness: |
2 nm |
TTV: |
<2 0µm |
Polished: |
on one side |